{"id":4966,"date":"2018-04-03T11:30:42","date_gmt":"2018-04-03T16:30:42","guid":{"rendered":"https:\/\/advancedplatingtech.com\/?p=4966"},"modified":"2024-12-10T09:43:21","modified_gmt":"2024-12-10T15:43:21","slug":"gold-plating-thickness-connectors","status":"publish","type":"page","link":"https:\/\/advancedplatingtech.com\/gold-plating\/gold-plating-thickness-connectors\/","title":{"rendered":"Gold Plating Thickness of Connectors and Contacts"},"content":{"rendered":"

Gold Plating Thickness of Connectors and Contacts\"gold<\/a><\/strong><\/h2>\n

Proper specification of gold plating thickness for connector and contact applications is a key design consideration.\u00a0 Gold plating<\/a> is an exceptional finish for connectors of that demand both high reliability and durability; however, the thickness of the gold plating will impact the durability and ultimate cycle life of the connector.\u00a0 Gold plated connectors have low contact resistance which is suitable for applications with low signal voltages and current in the millivolt and milliamp range.\u00a0 Because gold is a noble metal, it does not readily react with chemicals in most environments, meaning that gold plated connectors will retain their conductivity over time provide the thickness of the gold provides a sufficient barrier to the substrate from the environment.<\/p>\n

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Due to the high cost of the precious metal, gold plating of connectors is typically deposited in very thin layers of 5uin to 100uin (0.1um-25um) with respect to other plated metals.\u00a0 However, gold can be plated to thicknesses as high as 500uin to 1000uin (12.5um to 25um) in extreme cases.\u00a0 As the thickness of the gold is increased both the corrosion resistance and wear resistance of the gold plated connector increases.\u00a0 When connectors are plated with a very thin \u201cflash\u201d gold deposit (less than 10uin, 0.25um) the gold is a very porous.\u00a0 The gold plating thickness may look continuous but there are thousands of microscopic pores in the deposit making it more like a thin screen of gold rather than a continuous pore-free layer.\u00a0 Although the gold plating may not readily react to corrosive environments, the pores in the gold provide a path to the base material which will allow the substrate to oxidize and corrode through the gold.<\/p>\n

One method to increase both the corrosion protection and wear resistance of gold connector is to increase the thickness.\u00a0 As the gold plating thickness increases the pores in the deposit become reduced in size and quantity.\u00a0 Eventually as the thickness continues to increase the pores in the gold plating will become completely closed creating a pore-free gold layer.\u00a0 When gold plating is truly pore-free it provides exceptional barrier corrosion protection preventing corrosive attack of the material.\u00a0 However, due to the cost of gold, it is important to balance the functional requirements of the plating against the specified gold thickness to provide the most cost effective gold plated connector or contact.<\/p>\n

Thin Plated Gold Connectors or Contacts (4-20uin or 0.1-0.5um)<\/strong><\/h2>\n

For gold connectors used in a controlled environment with minimal wear considerations, common gold plating thickness is between 4-20uin (0.1-0.5um).\u00a0 Thin gold layers in this range can provide low contact resistance as well as excellent solderability\/wire bonding while consuming a minimal amount of gold.\u00a0\u00a0 This is a common thickness for static gold contacts that do not repeatedly cycle or slide during use.\u00a0 Examples include grounding nuts or studs, fixed contacts or solder pads.<\/p>\n

Moderate Thickness Gold Plated Connectors or Contacts (30-50uin or 0.75-1.25um)<\/strong><\/h2>\n
\"Gold<\/a>

Gold Plated Interconnect Pins<\/p><\/div>\n

For a connectors and contacts with moderate environmental and wear cycles, common functional gold plating thickness ranges between 30-50uin (0.75-1.25um).\u00a0 The increase in gold thickness to this level provides greatly improved corrosion resistance over that of thin gold or gold flash plating.\u00a0 In addition, thicknesses in this range offer moderate to good wear resistance for dynamic connector or contacts that cycle during use.\u00a0 Although the gold plating is not typically pore-free at these moderate levels, the thickness of the gold is sufficient to provide some barrier to corrosion in moderate environments that do not have repeated condensation cycles or the potential for corrosive chemical attack.\u00a0 Examples of components plated in this range of thickness include male\/female pins\/sockets, phosphor bronze or beryllium copper flex contacts or gold plated contact springs.<\/p>\n

High Thickness Gold Plated Connectors or Contacts (Greater than 50uin or 1.25um)<\/strong><\/h2>\n

For applications where the highest corrosion protection and wear resistance are required, heavier gold deposits of 50uin (1.25um) or more are typically required.\u00a0 Depending on base material and surface finish of the connector, 100uin\u00a0(2.5um) or more of gold plating is required to develop a fully pore-free layer that will provide the best barrier protection against corrosion of the base material.\u00a0 Gold plating of contacts or connectors greater that 50uin is common of mil-spec and Oil & Gas interconnect applications that are exposed to more aggressive environments as well as thermal and switching cycles.\u00a0 Heavier gold deposits in this range provide sufficient material to allow for very high cycle applications of 10,000 cycles or more when properly engineered with the proper underplate.<\/p>\n

Underplate Considerations for Gold Plated Connectors<\/strong><\/h2>\n

A nickel underplate is typically recommended for most gold plated connectors or contacts especially if the substrate is a copper or copper alloy.\u00a0\u00a0 Nickel serves several key fun\"\"<\/a>ctions as follows:<\/p>\n